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US Patent 8059443 Three-dimensional memory module architectures

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Date Filed
October 23, 2007
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Date of Patent
November 15, 2011
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Patent Application Number
11975963
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Patent Citations Received
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US Patent 12130485 Stacked-dies optically bridged multicomponent package
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US Patent 11790219 Three dimensional circuit implementing machine trained network
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US Patent 11881454 Stacked IC structure with orthogonal interconnect layers
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US Patent 12124095 Optical multi-die interconnect bridge with optical interface
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Patent Inventor Names
Jung Ho Ahn
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Moray McLaren
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Nathan Lorenzo Binkert
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Norman Paul Jouppi
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Alan Lynn Davis
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8059443
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Patent Primary Examiner
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Kiet Tuan Nguyen
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