Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wael O. Zohni0
Michael John Sebastian Smith0
William L. Schmidt0
Jeremy Matthew Plunkett0
Date of Patent
December 20, 2011
0Patent Application Number
122031000
Date Filed
September 2, 2008
0Patent Citations Received
0
0
...
Patent Primary Examiner
Patent abstract
One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
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