Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 27, 2011
Patent Application Number
11665648
Date Filed
October 31, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
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