Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Robert J. Greenberg0
Joseph H. Schulman0
Date of Patent
January 3, 2012
0Patent Application Number
122056590
Date Filed
September 5, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention is a low profile hermetic package for an implantable medical device. The package includes a non-conductive substrate including a plurality of straight conductive vias through the non-conductive substrate. A conductive cover hermetically enclosing an electronics circuit is bonded to the non-conductive substrate. The device is low profile. The width of the non-conductive substrate is grater than the height of the cover.
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