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US Patent 8096838 Header assembly for implantable medical devices

Patent 8096838 was granted and assigned to Bal Seal Engineering, Inc. on January, 2012 by the United States Patent and Trademark Office.

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Patent abstract

A header assembly for an implantable medical device (IMD). The header assembly includes a plurality of cavities with a plurality of insulating rings interdisposed between adjacent ones of the cavities. The cavities receive electrical contact rings. In certain embodiments, the insulating rings are formed integrally with a body of the header assembly.

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