US Patent 8097934 Delamination resistant device package having low moisture sensitivity
Patent 8097934 was granted and assigned to National Semiconductor on January, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 13, 2008
0
Date of Patent
January 17, 2012
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Patent Application Number
12191158
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Patent Inventor Names
Terh Kuen Yii
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Felix C. Li
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Lee Han Meng@Eugene Lee
0
Peng Soon Lim
0
Yee Kim Lee
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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