US Patent 8110652 Polyimide resin
Patent 8110652 was granted and assigned to Mitsubishi Gas Chemical Company on February, 2012 by the United States Patent and Trademark Office.
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Patent abstract
A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided.
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Patent Inventor Names
Jitsuo Oishi0
Shuta Kihara0
Tsuyoshi Bito0
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US Patent 08110652 Polyimide resin US Patent 8110652 Polyimide resin
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Patent Number
081106520
Patent Number
81106520
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081106520
Date of Patent
February 7, 2012
0Patent Application Number
123741100
Date Filed
July 17, 2007
0Patent Primary Examiner
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US Patent 08110652 Polyimide resin
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08110652
Date of patent
February 7, 2012
Patent application number
12374110
Date Filed
July 17, 2007
Patent primary examiner
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