US Patent 8114262 Thickness distribution control for electroplating
Patent 8114262 was granted and assigned to Sipix Imaging on February, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 10, 2007
Date of Patent
February 14, 2012
Patent Application Number
11621890
Patent Citations Received
Patent Inventor Names
Gary Yih-Ming Kang
0
Yi-Shung Chaug
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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