US Patent 8115316 Packaging board, semiconductor module, and portable apparatus
Patent 8115316 was granted and assigned to Sanyo on February, 2012 by the United States Patent and Trademark Office.
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Patent abstract
A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.
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US Patent 08115316 Packaging board, semiconductor module, and portable apparatus US Patent 8115316 Packaging board, semiconductor module, and portable apparatus
Infobox
Patent Number
0811531600
Patent Number
811531600
Edits on 23 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081153160
Date of Patent
February 14, 2012
0Patent Application Number
118479330
Date Filed
August 30, 2007
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
081153160
Date of Patent
February 14, 2012
0Patent Application Number
118479330
Date Filed
August 30, 2007
0Patent Primary Examiner
Edits on 14 Dec, 2021
Golden AI
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Infobox (+8 properties)
US Patent 08115316 Packaging board, semiconductor module, and portable apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08115316
Date of patent
February 14, 2012
Patent application number
11847933
Date Filed
August 30, 2007
Patent primary examiner
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