US Patent 8119214 Encapsulated cure systems
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Patent abstract
Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.
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Patent Inventor Names
Adam Gregg Malofsky0
Bernard Miles Malofsky0
Gregory Stephen Kulibert0
Michael Curley Krzoska0
Nagib Maurice Ward0
Todd Arlin Schwantes0
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US Patent 08119214 Encapsulated cure systems US Patent 8119214 Encapsulated cure systems
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Patent Number
08119214
Patent Number
8119214
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US Patent 08119214 Encapsulated cure systems
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Is a
Patent jurisdiction
Patent number
08119214
Date of patent
February 21, 2012
Patent application number
11216516
Date Filed
August 31, 2005
Patent primary examiner
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