Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jayna Sheats0
Date of Patent
February 28, 2012
0Patent Application Number
124842190
Date Filed
June 14, 2009
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. The process can separate the integrated circuits into an analog portion and a digital portion with the analog portion comprising passive components utilizing dielectric materials different than silicon dioxide and active components utilizing channel materials different than substrate single crystal silicon.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
