Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 28, 2012
Patent Application Number
11306806
Date Filed
January 11, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects.
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