Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kuniaki Mamitsu0
Takanori Teshima0
Date of Patent
February 28, 2012
0Patent Application Number
112627640
Date Filed
November 1, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.
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