US Patent 8136279 Electronic sign module housing having an overmolded gasket seal

An electronic sign module housing having an overmolded gasket seal including an elastomer overmolded gasket seal with an inner and an outer lip and a base overmolded to a rearwardly located contact surface of an electronic sign module housing. Grooves on the contact surface of the electronic sign module housing provide additional bonding surfaces with a greater surface area to enhance the chemically-bonded overmolding of the overmolded gasket seal. Truncated conical projections extending forwardly from the elastomer base extend into correspondingly shaped truncated conical cavities in the electronic sign module housing in order to provide additional chemical bonding and to provide a geometrically based frictional engagement arrangement.