US Patent 8144430 Multi-layer ground plane structures for integrated lead suspensions

Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of first conductive ground planes are located between the stainless steel base layer and the insulating layer opposite the insulating layer from the traces at the backed portions of the stainless steel base layer. A continuous second conductive ground plane is located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer.