US Patent 8153520 Thinning tungsten layer after through silicon via filling
Patent 8153520 was granted and assigned to Novellus Systems on April, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 3, 2009
0
Date of Patent
April 10, 2012
0
Patent Application Number
12534566
0
Patent Citations Received
•••
Patent Inventor Names
Anand Chandrashekar
0
Michal Danek
0
Raashina Humayun
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 8153520 Thinning tungsten layer after through silicon via filling
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
