Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomoya Kitagawa0
Ying-shu Quan0
Yoshikazu Tobinaga0
Akira Yamamoto0
Fumio Kamiyama0
Kentaro Ohshima0
Date of Patent
May 1, 2012
0Patent Application Number
125998600
Date Filed
April 1, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Microneedle device is provided, which include microneedles that can be easily inserted into skin and dissolve or swell in skin. The microneedle devices comprise a substrate and cone-shaped or pyramid-shaped microneedles for skin insertion set on the substrate. The microneedles for skin insertion contain over 50 weight percent of one or multiple biomaterials chosen from chitosan, collagen, gelatin, hyaluronic acid, and they are fabricated from the materials that can dissolve or swell in the body.
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