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US Patent 8173537 Methods for reducing UV and dielectric diffusion barrier interaction

Patent 8173537 was granted and assigned to Novellus Systems on May, 2012 by the United States Patent and Trademark Office.

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Patent abstract

Stability of an underlying dielectric diffusion barrier during deposition and ultraviolet (UV) processing of an overlying dielectric layer is critical for successful integration. UV-resistant diffusion barrier layers are formed by depositing the layer in a hydrogen-starved environment. Diffusion barrier layers can be made more resistant to UV radiation by thermal, plasma, or UV treatment during or after deposition. Lowering the modulus of the diffusion barrier layer can also improve the resistance to UV radiation.

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