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US Patent 8174921 Semiconductor memory device having shared temperature control circuit

Patent 8174921 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on May, 2012 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Current Assignee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
81749210
Patent Inventor Names
Ho-Young Kim0
Jung-Bae Lee0
Date of Patent
May 8, 2012
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Patent Application Number
125896740
Date Filed
October 27, 2009
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Patent Citations Received
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US Patent 12125514 Apparatuses and methods for access based refresh operations
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US Patent 11935576 Semiconductor device performing row hammer refresh operation
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US Patent 11955158 Apparatuses and methods for access based refresh timing
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US Patent 11984148 Apparatuses and methods for tracking victim rows
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US Patent 12002501 Apparatuses and methods for distributed targeted refresh operations
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US Patent 12112787 Apparatuses and methods for access based targeted refresh operations
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US Patent 11664063 Apparatuses and methods for countering memory attacks
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US Patent 11688451 Apparatuses, systems, and methods for main sketch and slim sketch circuit for row address tracking
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...
Patent Primary Examiner
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Hoai V Ho
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Patent abstract

A semiconductor memory device includes a plurality of memory banks; a plurality of temperature sensing circuits, and a shared control circuit. The temperature sensing circuits correspond to the memory banks and each is disposed in the vicinity of a corresponding memory bank. The shared control circuit is connected to the plurality of temperature sensing circuits and a plurality of refresh circuits for refreshing the plurality of memory banks, performs calibration on the plurality of temperature sensing circuits, performs digital processing on signals for separately controlling refresh intervals for the plurality of memory banks, and transmits the processed signals to the plurality of refresh circuits. Therefore, the refresh intervals for individual channels or banks are separately or selectively controlled. Further, since the plurality of temperature sensing circuits are connected to the shared temperature control circuit, the occupied area of the circuits in a chip is reduced or minimized.

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