US Patent 8197285 Methods and apparatus for a grounding gasket

A conductive gasket includes a deformable contact region configured to provide compressive contact between the mounting surface of a connector (e.g., a right-angle micro-D connector) and a grounded surface of the substrate (e.g., PCB). A fastener region extends from the deformable contact region and is configured to align with a mounting region of the connector. A keep-out zone is provided adjacent to the deformable contact region and the fastener region and is configured to allow the pins of the connector to pass therethrough.