Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Byung Joon Han0
Il Kwon Shim0
Seng Guan Chow0
Date of Patent
June 12, 2012
0Patent Application Number
116707140
Date Filed
February 2, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer on a side opposite the base die.
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