Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Halvar Young Loken0
Subhotosh Khan0
Date of Patent
June 26, 2012
0Patent Application Number
130339140
Date Filed
June 2, 2011
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
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