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US Patent 8211722 Flip-chip GaN LED fabrication method
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Patent
Date Filed
June 21, 2011
Date of Patent
July 3, 2012
Patent Application Number
13165238
Patent Citations Received
US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
0
US Patent 11860415 Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
0
US Patent 11762200 Bonded optical devices
Patent Inventor Names
Lien-Shine Lu
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
8211722
Patent Primary Examiner
Alexander Ghyka
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