US Patent 8237259 Embedded chip package
Patent 8237259 was granted and assigned to Infineon Technologies on August, 2012 by the United States Patent and Trademark Office.
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Patent Citations Received
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Patent abstract
An electronic assembly is disclosed. One embodiment includes at least one semiconductor chip and a package structure embedding the semiconductor chip. The package structure includes at least one conducting line extending into an area of the package structure outside of the outline of the chip. The electronic assembly further includes a substrate embedding the package structure.
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US Patent 08237259 Embedded chip package US Patent 8237259 Embedded chip package
Infobox
Patent Number
0823725900
Patent Number
823725900
Edits on 27 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
082372590
Date of Patent
August 7, 2012
0Patent Application Number
117624110
Date Filed
June 13, 2007
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
082372590
Date of Patent
August 7, 2012
0Patent Application Number
117624110
Date Filed
June 13, 2007
0Patent Primary Examiner
Edits on 15 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 08237259 Embedded chip package
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08237259
Date of patent
August 7, 2012
Patent application number
11762411
Date Filed
June 13, 2007
Patent primary examiner
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