US Patent 8268699 Wafer structures and wafer bonding methods

Patent 8268699 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on September, 2012 by the United States Patent and Trademark Office.

Is a

Current Assignee

Patent Jurisdiction

Patent Number

Patent Inventor Names

Kyoung-Kook Kim0

Yu-Sik Kim0

Sang-Joon Park0

Date of Patent

September 18, 2012

Patent Application Number

12384617

Date Filed

April 7, 2009

Patent Citations Received

Patent Primary Examiner

No article content yet.

No Timeline data yet.

Title

Author

Link

Type

Date

No Further Resources data yet.

Find more entities like US Patent 8268699 Wafer structures and wafer bonding methods

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.