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US Patent 8270170 Contact cooled electronic enclosure

Patent 8270170 was granted and assigned to Clustered Systems Company on September, 2012 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Clustered Systems Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8270170

Patent Inventor Names

Robert J. Lipps0

Phillip N. Hughes0

Date of Patent

September 18, 2012

Patent Application Number

12535272

Date Filed

August 4, 2009

Patent Citations Received

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US Patent 11778788 Self-expanding gap filler for decreasing air leakage between adjacent elements in a data center

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US Patent 12010818 Self-expanding gap filler for decreasing air leakage between adjacent elements in a data center

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US Patent 11879686 Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices

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US Patent 11840013 Graphite materials and devices with surface micro-texturing

Patent Primary Examiner

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Courtney Smith

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