‌

US Patent 8288854 Semiconductor package and method for making the same

Overview Structured Data Issues Contributors

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

October 16, 2012

Patent Application Number

12783104

Date Filed

May 19, 2010

Patent Citations Received

US Patent 12130485 Stacked-dies optically bridged multicomponent package

0

US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing

0

US Patent 12125826 Wafer-level stacked die structures and associated systems and methods

0

US Patent 12124095 Optical multi-die interconnect bridge with optical interface

0

US Patent 11749607 Package and method of manufacturing the same

Patent Primary Examiner

Peniel M Gumedzoe

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 8288854 Semiconductor package and method for making the same

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Golden Query Tool