US Patent 8304275 MEMS device assembly and method of packaging same

Patent 8304275 was granted and assigned to Freescale Semiconductor on November, 2012 by the United States Patent and Trademark Office.

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Patent Inventor Names

Yizhen Lin0

Mark E. Schlarmann0

Date of Patent

November 6, 2012

Patent Application Number

12873195

Date Filed

August 31, 2010

Patent Citations Received

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