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US Patent 8308931 Method and apparatus for electroplating

Patent 8308931 was granted and assigned to Novellus Systems on November, 2012 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Novellus Systems

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

83089310

Patent Inventor Names

Bryan Buckalew0

Glenn Ibarreta0

Jonathan Reid0

Patrick Breling0

Seshasayee Varadarajan0

Seyang Park0

Steven Mayer0

Thomas Ponnuswamy0

...

Date of Patent

November 13, 2012

Patent Application Number

122913560

Date Filed

November 7, 2008

Patent Citations Received

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US Patent 11946142 Spatially tunable deposition to compensate within wafer differential bow

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US Patent 11851760 PECVD deposition system for deposition on selective side of the substrate

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US Patent 11859300 Controlling plating electrolyte concentration on an electrochemical plating apparatus

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US Patent 11904129 Coupling device and method for using the same

Patent Primary Examiner

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Harry D Wilkins, III

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