US Patent 8319230 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
Patent 8319230 was granted and assigned to Banpil Photonics, Inc. on November, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 6, 2011
Date of Patent
November 27, 2012
Patent Application Number
13041425
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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