US Patent 8324031 Diffusion barrier and method of formation thereof

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Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8324031

Patent Inventor Names

Shyue Seng Tan0

Yung Fu Chong0

Elgin Quek0

Lee Wee Teo0

Sanford Chu0

Date of Patent

December 4, 2012

Patent Application Number

12144652

Date Filed

June 24, 2008

Patent Citations Received

‌

US Patent 12027580 Semiconductor on insulator wafer with cavity structures

‌

US Patent 11749559 Bulk substrates with a self-aligned buried polycrystalline layer

Patent Primary Examiner

‌

Thao Le

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