US Patent 8324095 Integration of ALD tantalum nitride for copper metallization

Patent 8324095 was granted and assigned to Applied Materials on December, 2012 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

83240950

Patent Inventor Names

Nirmalya Maity0

Hua Chung0

Jick Yu0

Mei Chang0

Roderick Craig Mosely0

Date of Patent

December 4, 2012

Patent Application Number

126279770

Date Filed

November 30, 2009

Patent Citations Received

‌

US Patent 11778926 Method and apparatus for deposition of multilayer device with superconductive film

‌

US Patent 11788883 SNSPD with integrated aluminum nitride seed or waveguide layer

Patent Primary Examiner

‌

Alexander Ghyka

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