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US Patent 8324646 Chip coated light emitting diode package and manufacturing method thereof

Patent 8324646 was granted and assigned to Samsung Electronics on December, 2012 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Samsung Electronics

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

83246460

Patent Inventor Names

Kyung Taeg Han0

Seon Goo Lee0

Seong Yeon Han0

Date of Patent

December 4, 2012

Patent Application Number

128424930

Date Filed

July 23, 2010

Patent Citations Received

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US Patent 11804513 Semiconductor light-emitting devices and methods of manufacturing the same

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US Patent 11757076 Light source module and display panel using the same

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US Patent 11762256 Light emitting diode package and electronic device including the same

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US Patent 11764336 Semiconductor light emitting device

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US Patent 11784285 Three dimensionally structured semiconductor light emitting diode and display apparatus

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US Patent 11805580 LED driving device and lighting device including the same

Patent Primary Examiner

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N. Drew Richards

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