US Patent 8325486 Tamper respondent module

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

83254860

Patent Inventor Names

Jing Kwok0

Ivan Straznicky0

Martin Terence Cassels0

Nauman Arshad0

Date of Patent

December 4, 2012

Patent Application Number

126864920

Date Filed

January 13, 2010

Patent Citations Received

‌

US Patent 11882645 Multi chip hardware security module

‌

US Patent 11716808 Tamper-respondent assemblies with porous heat transfer element(s)

Patent Primary Examiner

‌

Xiaoliang Chen

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