US Patent 8331094 Thermal and power bus stacked package architecture

Patent 8331094 was granted and assigned to Oracle on December, 2012 by the United States Patent and Trademark Office.

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Seshasayee Ankireddi0

Vadim Gektin0

Date of Patent

December 11, 2012

Patent Application Number

130120780

Date Filed

January 24, 2011

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