US Patent 8351158 Top bond pad for transducing head interconnect
Patent 8351158 was granted and assigned to Seagate Technology on January, 2013 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 11, 2011
Date of Patent
January 8, 2013
Patent Application Number
13046242
Patent Citations Received
Patent Inventor Names
Joel W. Hoehn
0
Lance E. Stover
0
David A. Sluzewski
0
Jianxin Zhu
0
Kevin J. Schulz
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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