US Patent 8362496 Optical module package unit

An optical module package unit includes a light-emitting chip and a light sensor chip respectively installed in a light-emitting zone and a light-sensing zone on a substrate, a lid of plastic shell integrally formed on the substrate and defining therein a first cavity and a second cavity around the light-emitting chip and the light sensor chip respectively, and two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively. As the light-emitting chip and the light sensor chip are integrally packaged on the substrate, the packaging cost of the optical module is significantly lowered.