US Patent 8362613 Flip chip device having simplified routing
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Patent abstract
The present disclosure is directed to a semiconductor die having a chip outline boundary, a die seal, a row of input/output contact pads separated from the chip outline boundary by the die seal, a first row of solder bump connections positioned between the row of input/output contact pads and the die seal, and a second row of solder bump connections separated from the first row of solder bump connections by the row of input/output contact pads.
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Patent Inventor Names
Anil Yadav0
Rajesh Bajaj0
Sanjeev Kumar Jain0
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US Patent 08362613 Flip chip device having simplified routing US Patent 8362613 Flip chip device having simplified routing
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Patent Number
08362613
Patent Number
8362613
Edits on 15 Dec, 2021
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US Patent 08362613 Flip chip device having simplified routing
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Is a
Patent jurisdiction
Patent number
08362613
Date of patent
January 29, 2013
Patent application number
12982168
Date Filed
December 30, 2010
Patent primary examiner
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