Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Yen Lee0
Ming-Fa Chen0
Date of Patent
February 19, 2013
0Patent Application Number
127177790
Date Filed
March 4, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A package structure includes a first die, and a second die over and bonded to the first die. The second die has a size smaller than a size of the first die. A dummy chip is over and bonded onto the first die. The dummy chip includes a portion encircling the second die. The dummy chip includes a material selected from the group consisting essentially of silicon and a metal.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
