US Patent 8379384 Cooling structure for electronic device, and a method

This disclosure relates to a cooling structure for an electronic device including an inlet for conveying a flow in a first flow direction towards a first component and an outlet for conveying the flow further. To deter dirt particles from proceeding to electronic components, the cooling structure can include a second flow channel, which starts from a port oriented transversely to the first flow direction or away therefrom and receives part of the flow from the inlet, and which conveys the part of the flow to an electronic component located in the second flow channel.