US Patent 8389864 Warp reactive IC package

An apparatus and method for temperature induced warpage compensation in an integrated circuit package is disclosed. The apparatus consists of a layer of material bonded to the top of the integrated circuit package. The layer of material may have a generally planar-convex or a generally planar-concave cross-section. By appropriate choice of temperature coefficient and degree of concavity or convexity, the layer of material can compensate for either convex or concave warpage. In some embodiments the layer of material has apertures therein allowing compensation for more complex warpages. The apparatus provides an alternative to apparatus for dealing with IC package warpage known in the art.