Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 5, 2013
Patent Application Number
12706040
Date Filed
February 16, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
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