Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ho-Cheol Lee0
Jung-Bae Lee0
Jang-Woo Ryu0
Chi-Sung Oh0
Dong-Hyuk Lee0
Date of Patent
March 12, 2013
0Patent Application Number
129005470
Date Filed
October 8, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device is provided. The semiconductor device applies data applied through a bump pad on which a bump is mounted through a test pad to a test apparatus such that the reliability of the test can be improved. The amount of test pads is significantly reduced by allowing data output through bump pads to be selectively applied to a test pad. Data and signals applied from test pads are synchronized with each other and applied to bump pads during a test operation such that the reliability of the test can be improved without the need of an additional test chip.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.