US Patent 8413321 Module substrate and production method
Patent 8413321 was granted and assigned to Epcos Ag on April, 2013 by the United States Patent and Trademark Office.
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Patent abstract
A module substrate includes a multilayer substrate that includes a plurality of layers, a bottommost of the layers being a ceramic layer. Solderable contacts, which include fired pads composed of a conductive paste, are applied to the bottommost ceramic layer. A covering layer overlies the pads. The covering layer covers all outer edges of the pads. A window is cut out of the covering layer. A metallic coating is applied to each pad exclusively within the window.
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Patent Inventor Names
Annette Fischer0
Franz Kaul0
Sebastian Brunner0
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US Patent 08413321 Module substrate and production method US Patent 8413321 Module substrate and production method
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Patent Number
08413321
Patent Number
8413321
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US Patent 08413321 Module substrate and production method
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Is a
Current assignee
Patent jurisdiction
Patent number
08413321
Date of patent
April 9, 2013
Patent application number
12718823
Date Filed
March 5, 2010
Patent primary examiner
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