Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsing-Kuo Hsia0
Chih-Kuang Yu0
Chyi Shyuan Chern0
Gordon Kuo0
Date of Patent
April 9, 2013
0Patent Application Number
129448950
Date Filed
November 12, 2010
0Patent Primary Examiner
Patent abstract
An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.
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