Patent attributes
A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.
