US Patent 8434536 Heat-seal system and method

A heat-seal device generally includes a heat source, a thermal conductor, which encapsulates at least a portion of the heat source and is capable of transferring heat from the heat source, and a thermal insulator, which substantially surrounds the thermal conductor but leaves a portion thereof exposed, the exposed portion of the thermal conductor providing a heat-seal contact surface, which is adapted to be brought into contact with a material to be sealed.