US Patent 8436426 Multi-layer via-less thin film resistor
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Patent abstract
The present disclosure is directed to a thin film resistor having a first resistor layer having a first temperature coefficient of resistance and a second resistor layer on the first resistor layer, the second resistor layer having a second temperature coefficient of resistance different from the first temperature coefficient of resistance. The first temperature coefficient of resistance may be positive while the second temperature coefficient of resistance is negative. The first resistor layer may have a thickness in the range of 50 and 150 angstroms and the second resistor layer may have a thickness in the range of 20 and 50 angstroms.
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Patent Inventor Names
Calvin Leung0
Olivier Le Neel0
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US Patent 08436426 Multi-layer via-less thin film resistor US Patent 8436426 Multi-layer via-less thin film resistor
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Patent Number
08436426
Patent Number
8436426
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US Patent 08436426 Multi-layer via-less thin film resistor
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Is a
Patent jurisdiction
Patent number
08436426
Date of patent
May 7, 2013
Patent application number
12862594
Date Filed
August 24, 2010
Patent primary examiner
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