US Patent 8445554 Compressed porous materials suitable for implant
Patent 8445554 was granted and assigned to Kensey Nash Corporation on May, 2013 by the United States Patent and Trademark Office.
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Patent abstract
A high strength porous polymeric material manufactured by a compression process is disclosed. The material results in a network of interconnected collapsed pores, which forces thin overlapping walls and passages to be created. The network provides permeable access for fluid migration throughout the material. The strength and/or permeability are advantageous for medical devices and implants.
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US Patent 08445554 Compressed porous materials suitable for implant US Patent 8445554 Compressed porous materials suitable for implant
Infobox
Patent Number
0844555400
Patent Number
844555400
Edits on 24 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084455540
Date of Patent
May 21, 2013
0Patent Application Number
127859490
Date Filed
May 24, 2010
0Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084455540
Date of Patent
May 21, 2013
0Patent Application Number
127859490
Date Filed
May 24, 2010
0Patent Primary Examiner
Edits on 16 Dec, 2021
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US Patent 08445554 Compressed porous materials suitable for implant
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08445554
Date of patent
May 21, 2013
Patent application number
12785949
Date Filed
May 24, 2010
Patent primary examiner
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