Patent attributes
A novel polyimide resin is formed by imidizing a diamine component including an amide group-containing siloxane diamine compound represented by the following formula (1) and an acid dianhydride component including an aromatic acid dianhydride such as 3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride. This novel polyimide resin utilizes a novel polyimide resin into which a reaction group capable of reacting with a crosslinking agent to form a crosslinking point is pre-introduced before imidization. The novel polyimide resin can confer a comparatively low elastic modulus and heat resistance to a dry film or a photosensitive cover film formed from a photosensitive polyimide resin composition containing the novel polyimide resin.